VPC3i Vacuum plasma cleaning machine(Inline)
I
nline vacuum plasma cleaning machine
Modle
No.:
VPC3i
Manufacturer
: Beijing
Torch SMT Incorporated Company
I.
Equipment name, type number, origin and delivery date
1.1
E
quipment name:
I
nline vacuum plasma cleaning machine
1.2
Model
No.:
VPC3i
1.3
O
rigin (country, manufacturer):
Beijing Torch SMT Incorporated Company
1.4
D
elivery date: 4-8 weeks after the contract
com
es
into
effect
1.5
M
ainly used for plasma surface treatment process in semiconductor
enclosure
fields such as silicon wafer, glass substrate, ceramic substrate, IC carrier plate, copper lead frame, large-size single-sided substrate power board, IGBT module, MEMS sensor with fixture, microwave device, filter, RF device, etc.
II
Main technical performance
parameters
:
2.1 volume of vacuum chamber: 3L
2.2 vacuum degree:
The maximum vacuum degree of
VPC3i
vacuum plasma cleaner is less than 10 Pa (mechanical dry pump 8L)
2.3
E
ffective cleaning area:
Single cleaning area: 350 * 100 * 85mm
Plasma frequency: 13.56hz 300W
RF (volume treatment, with water cooling)
2.4
H
eight of vacuum chamber:
Furnace height
:
100mm (effective size)
2.5
C
leaning temperature:
Low temperature cleaning (below room temperature).
2.6
C
leaning
frequency
:
30-120s
2.7
C
leaning effect:
the dyne value can reach 70. The water drop angle is 15 degrees, and
it
can be
optimally
controlled within 10
degrees
(
Workshop with air cleanliness at
Class 100 dust-free
can be cleaned
within 4 hours)
2.8
G
as
can be used
:
Argon, nitrogen, oxygen, nitrogen hydrogen mixture, hydrogen and formic acid
, etc
.
2.9
VPC3i
vacuum plasma cleaning machine is equipped with software control system:
The s
oftware control system
is
easy to operate,
it enables
control equipment
connecting,
and various cleaning process curves
can be set
, and
curves can be
set, modify, store and
select for use
according to different processes; The software has its own analysis function, which can analyze the process curve. The software control system
will
automatically record the cleaning process, temperature curve, time and alarm related data in real time to ensure the traceability of product cleaning process.
2.10
T
he equipment does not need to be calibrated
thus no
more calibration fees
will occur
2.11
O
perating power consumption:
2.2kW, excluding the power consumption of chiller
2.12
T
he function of over temperature alarm and recording. (standard configuration)
VPC3i
vacuum plasma cleaning machine
is
function
ed with
workpiece surface
over temperature protection
,
alarm
ing
, temperature safety protection and recording of the whole machine
during cleaning
process
.
2.13
N
itrogen, argon and other flow management and analysis systems (Software + hardware). (optional)
VPC3i
vacuum plasma cleaning machine
is
function
ed by
real-time management and analysis of process gases such as nitrogen and argon consumed by the whole machine, and can record and analyze the gas consumption, daily consumption, weekly consumption and
different
time period consumption in real time.
2.14
P
rocess gas pressure alarm function and analysis system (Software + hardware). (optional)
VPC3i
vacuum plasma cleaning machine
is
function
ed by
undervoltage alarm, recording and analysis of process gas source in the production process of the whole machine, which is very useful for product quality traceability.
2.15
E
nergy management and analysis system (Software + hardware). (optional)
VPC3i
vacuum plasma cleaning machine
is
function
ed by
real-time management and analysis of energy consumption, and can analyze the recording of real-time power consumption, daily power consumption, weekly power consumption, time period power consumption, etc.
2.16
O
xygen content management and analysis system (Software + hardware) (optional)
VPC3i
vacuum plasma cleaning machine
is
function
ed by
real-time management and analysis of oxygen content in the vacuum chamber of the whole machine. It can analyze, record and analyze the PPM value of oxygen content in real time for product quality traceability and analysis.
2.17 MES data interface subsystem (Software + hardware). (optional)
VPC3i
vacuum plasma cleaning machine
is also functioned by
MES data interface of the whole machine, and MES system can be selected and configured to complete various data acquisition and analysis of intelligent equipment.
2.18
O
verall dimensions:
550 * 1260 * 1480mm (excluding alarm light)
2.19
I
nternal structure:
see the right
figure